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Technical Specifications
TDK B58623K1510A070 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
DIP
Package Description
Dual In Line Package
Lead Shape
Through Hole
Pin Count
8
PCB
8
Package Length (mm)
17.8
Package Width (mm)
17.8
Package Height (mm)
22.2
Seated Plane Height (mm)
25.9
Pin Pitch (mm)
2.54
Mounting
Through Hole
Compliance
Cage Code
SG168
EU RoHS
Yes
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
TDK B58623K1510A070 Datasheet
Download the complete datasheet for TDK B58623K1510A070 to view detailed technical specifications.
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