TDK
B82422T3390-J008
Inductor General Purpose Chip Molded Wirewound 0.039uH 5% 100MHz 25Q-Factor Ceramic 0.45A 0.19Ohm DCR 1210 Automotive T/R
Inductance0.039uH
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Technical Specifications
TDK B82422T3390-J008 technical specifications.
General
| Type | General Purpose Chip |
| Technology | Wirewound |
| Protection Style | Molded |
| Core Material | Ceramic |
| Inductance | 0.039uH |
| Tolerance | 5% |
| Inductance Test Frequency | 100MHz |
| Maximum DC Current | 0.45A |
| Maximum Saturation Current | 0.45A |
| Max DC Resistance | 0.19Ohm |
| Minimum Quality Factor | 25 |
| Minimum Self Resonant Frequency | 1300MHz |
| Case Size | 1210 |
| Product Length | 3.5mm |
| Height | 2.1mm |
| Product Depth | 2.8mm |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
Compliance
| RoHS | Yes |
| RoHS Version | 2011/65/EU, 2015/863 |
Datasheet
TDK B82422T3390-J008 Datasheet
Download the complete datasheet for TDK B82422T3390-J008 to view detailed technical specifications.
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