20-position, 2-row unshrouded header with 2.54mm pitch and 2.54mm row spacing. Features male pin contacts made of copper alloy with gold, tin, and lead plating, rated for 3A current. Vertical orientation, through-hole termination with press-fit mounting and PCB mount retention. High temperature thermoplastic housing in black, with a maximum operating temperature of 125°C.
TE Connectivity 103233-9 technical specifications.
| Approvals | UL |
| Board Standoff | No (Without) |
| Contact Current Rating | 3A |
| Contact Finish - Mating | GOLD |
| Contact Gender | Male |
| Contact Material | Copper Alloy |
| Contact Mating Length | 0.32inch |
| Contact Plating | Gold, Tin, Lead |
| Contact Post Length | 6.35mm |
| Contact Protection | No (Without) |
| Contact Shape | Square |
| Contact Type | Male Pin |
| Current Rating | 3A |
| ELV | Non-Compliant |
| Flammability Rating | UL94 V-0 |
| Gasket | No (Without) |
| High Speed Serial Data Connector | No |
| High Temperature Housing | Yes |
| Housing Color | Black |
| Insulation Color | Black |
| Insulation Material | Thermoplastic |
| Keyed | No |
| Mating Alignment | No (Without) |
| Mating Connector Lock | No (Without) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -55°C |
| Mount | Through Hole |
| Number of Contacts | 20 |
| Number of Positions | 20 |
| Number of Rows | 2 |
| Orientation | Vertical |
| Package Quantity | 150 |
| Packaging | Carton |
| PCB Mount Retention | With |
| PCB Mounting Orientation | Vertical |
| PCB Thickness | 3.18mm |
| Pitch | 2.54mm |
| Radiation Hardening | No |
| RoHS Compliant | No |
| Row Spacing | 2.54mm |
| Selectively Loaded | No (Without) |
| Series | AMPMODU MOD II |
| Stabilizers | No (Without) |
| Strain Relief | No (Without) |
| Termination | Through Hole |
| RoHS | Not CompliantNo |
Download the complete datasheet for TE Connectivity 103233-9 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.