120523-1

64 Pos 1mm Pitch Shrouded Header, SMD, Board-to-Board

64-position, 2-row shrouded header for board-to-board applications. Features a 1mm pitch, 0.33-inch height, and 13mm mated stacking height. Supports differential signaling with a 160MHz -3dB bandwidth and 3600V/µs slew rate. Surface mount termination with gold, tin, lead, matte contact plating and nickel underplate. Rated for 1A contact current and operates from -67°C to 230°C. Compliant with ELV and UL94 V-0 flammability rating.

PackageSOIC

Current Rating1A

MountingSurface Mount

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Technical Specifications

TE Connectivity 120523-1 technical specifications.

General

-3db Bandwidth	160MHz
Approvals	CSA
Boss	Yes (With)
Package/Case	SOIC
Connector System	Board-to-Board
Contact Current Rating	1A
Contact Material	Bronze
Contact Plating	Gold, Tin, Lead, Matte
Current Rating	1A
Differential Signaling	Yes
ELV	Compliant
Flammability Rating	UL94 V-0
Gain Bandwidth Product	100MHz
Height	0.33inch
Housing Color	Black
Input Bias Current	1uA
Input Offset Voltage (Vos)	1.5mV
Length	34.22mm
Mated Stacking Heights	13mm
Mating Alignment	No (Without)
Mating Retention	No (Without)
Max Operating Temperature	230°C
Min Operating Temperature	-67°C
Mount	Surface Mount
Number of Circuits	1
Number of Columns	32
Number of Contacts	64
Number of Positions	64
Number of Rows	2
Operating Supply Current	2.5mA
Output Current per Channel	116mA
Package Quantity	400
Packaging	Tape and Reel
PCB Mount Alignment	Yes (With)
PCB Mount Retention	Without
PCB Mounting Orientation	Vertical
Pitch	0.039inch
Plating Thickness	3.81um
Radiation Hardening	No
RoHS Compliant	No
Row Spacing	1mm
Series	Free Height (FH) IEEE 1386, PMC
Slew Rate	3600V/µs
Stack Height	0.512inch
Stackable	Yes
Tail Length	0.081inch
Termination	SMD/SMT
Underplate Material	Nickel
Width	6.04mm