64-position, 2-row shrouded header for board-to-board applications. Features a 1mm pitch, 0.33-inch height, and 13mm mated stacking height. Supports differential signaling with a 160MHz -3dB bandwidth and 3600V/µs slew rate. Surface mount termination with gold, tin, lead, matte contact plating and nickel underplate. Rated for 1A contact current and operates from -67°C to 230°C. Compliant with ELV and UL94 V-0 flammability rating.
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| -3db Bandwidth | 160MHz |
| Approvals | CSA |
| Boss | Yes (With) |
| Package/Case | SOIC |
| Connector System | Board-to-Board |
| Contact Current Rating | 1A |
| Contact Material | Bronze |
| Contact Plating | Gold, Tin, Lead, Matte |
| Current Rating | 1A |
| Differential Signaling | Yes |
| ELV | Compliant |
| Flammability Rating | UL94 V-0 |
| Gain Bandwidth Product | 100MHz |
| Height | 0.33inch |
| Housing Color | Black |
| Input Bias Current | 1uA |
| Input Offset Voltage (Vos) | 1.5mV |
| Length | 34.22mm |
| Mated Stacking Heights | 13mm |
| Mating Alignment | No (Without) |
| Mating Retention | No (Without) |
| Max Operating Temperature | 230°C |
| Min Operating Temperature | -67°C |
| Mount | Surface Mount |
| Number of Circuits | 1 |
| Number of Columns | 32 |
| Number of Contacts | 64 |
| Number of Positions | 64 |
| Number of Rows | 2 |
| Operating Supply Current | 2.5mA |
| Output Current per Channel | 116mA |
| Package Quantity | 400 |
| Packaging | Tape and Reel |
| PCB Mount Alignment | Yes (With) |
| PCB Mount Retention | Without |
| PCB Mounting Orientation | Vertical |
| Pitch | 0.039inch |
| Plating Thickness | 3.81um |
| Radiation Hardening | No |
| RoHS Compliant | No |
| Row Spacing | 1mm |
| Series | Free Height (FH) IEEE 1386, PMC |
| Slew Rate | 3600V/µs |
| Stack Height | 0.512inch |
| Stackable | Yes |
| Tail Length | 0.081inch |
| Termination | SMD/SMT |
| Underplate Material | Nickel |
| Width | 6.04mm |
| RoHS | Not CompliantNo |
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