Vertical, through-hole mount header with a 2.54mm pitch, featuring a 3-position, 1-row configuration. Male pin contacts made of copper alloy with gold mating finish, gold, tin, and matte plating, and a square contact shape. Includes board standoff and PCB mount retention, with high-temperature compatibility and a black thermoplastic housing.
MountingThrough Hole, Solder
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Technical Specifications
TE Connectivity 1571839-2 technical specifications.
General
| Board Standoff | Yes (With) |
| Contact Finish - Mating | GOLD |
| Contact Material | Copper Alloy |
| Contact Mating Length | 0.23inch |
| Contact Plating | Gold, Tin, Matte |
| Contact Post Length | 0.12inch |
| Contact Protection | No (Without) |
| Contact Shape | Square |
| Contact Type | Male Pin |
| ELV | Compliant |
| Gasket | No (Without) |
| High Speed Serial Data Connector | No |
| High Temperature Compatible | Yes |
| High Temperature Housing | Yes |
| Housing Color | Black |
| Insulation Color | Black |
| Insulation Material | Thermoplastic |
| Keyed | No |
| Mating Alignment | No (Without) |
| Mating Connector Lock | No (Without) |
| Mount | Through Hole, Solder |
| Number of Positions | 3 |
| Number of Rows | 1 |
| Orientation | Vertical |
| Package Quantity | 540 |
| Packaging | Carton |
| PCB Mount Retention | With |
| PCB Mounting Orientation | Vertical |
| Pitch | 2.54mm |
| RoHS Compliant | Yes |
| Sealable | No (Without) |
| Selectively Loaded | No (Without) |
| Series | AMPMODU MOD II |
| Stabilizers | No (Without) |
| Strain Relief | No (Without) |
| Termination | Solder |
| Underplate Material | Nickel |
Compliance
| RoHS | Compliant |
Datasheet
No datasheet is available for this part.