
200-position, 2-row right-angle header and receptacle for board-to-board applications. Features a 0.024-inch pitch and 0.244-inch row spacing, supporting SDRAM and DDR2 SDRAM memory types. Designed for surface mount termination with a 0.315-inch stack height and 26.5mm depth. Contacts are copper alloy with gold plating, rated for 500mA and 1.8V. Housing is black thermoplastic with UL94 V-0 flammability rating, operating from -67°C to 185°C. Compliant with ELV and RoHS standards.
TE Connectivity 1827341-4 technical specifications.
| Circuit Application | Power |
| Connector System | Cable-to-Board |
| Contact Current Rating | 500mA |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Depth | 26.5mm |
| ELV | Compliant |
| Flammability Rating | UL94 V-0 |
| Height | 8mm |
| Housing Color | Black |
| Insulation Material | Thermoplastic |
| Lead Free | Lead Free |
| Max Operating Temperature | 185°C |
| Memory Type | SDRAM, DDR2 SDRAM, |
| Min Operating Temperature | -67°C |
| Mount | Surface Mount |
| Number of Contacts | 200 |
| Number of Positions | 200 |
| Number of Rows | 2 |
| Orientation | Right Angle |
| Package Quantity | 20 |
| Packaging | Tray |
| PCB Mount Retention | With |
| Pitch | 0.024inch |
| Plating | Gold |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Row Spacing | 0.244inch |
| Sealable | No (Without) |
| Stack Height | 0.315inch |
| Termination | SMD/SMT |
| Voltage Rating | 1.8V |
| RoHS | Compliant |
Download the complete datasheet for TE Connectivity 1827341-4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
