Surface mount, straight orientation, 204-position, 2-row board-to-board header for DDR3 SDRAM applications. Features a 0.024-inch pitch and 0.362-inch stack height, with copper alloy contacts plated in gold for reliable power and signal transmission. Rated for 500mA contact current and operating temperatures from -67°C to 185°C. Packaged in tape and reel for automated assembly, with UL94 V-0 flammability rating and RoHS compliance.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the TE Connectivity 2-2013311-1 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Circuit Application | Power |
| Connector System | Cable-to-Board |
| Contact Current Rating | 500mA |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| ELV | Compliant |
| Flammability Rating | UL94 V-0 |
| Housing Color | Black |
| Lead Free | Lead Free |
| Max Operating Temperature | 185°C |
| Memory Type | SDRAM, DDR3 SDRAM, |
| Min Operating Temperature | -67°C |
| Mount | Surface Mount |
| Number of Contacts | 204 |
| Number of Positions | 204 |
| Number of Rows | 2 |
| Orientation | Straight |
| Package Quantity | 150 |
| Packaging | Tape and Reel |
| PCB Mount Retention | With |
| Pitch | 0.024inch |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Row Spacing | 0.322inch |
| Sealable | No (Without) |
| Stack Height | 0.362inch |
| Termination | Solder |
| RoHS | Compliant |
Download the complete datasheet for TE Connectivity 2-2013311-1 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
