Surface mount, straight orientation, 204-position, 2-row board-to-board header for DDR3 SDRAM applications. Features a 0.024-inch pitch and 0.362-inch stack height, with copper alloy contacts plated in gold for reliable power and signal transmission. Rated for 500mA contact current and operating temperatures from -67°C to 185°C. Packaged in tape and reel for automated assembly, with UL94 V-0 flammability rating and RoHS compliance.
MountingSurface Mount
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Technical Specifications
TE Connectivity 2-2013311-1 technical specifications.
General
Circuit Application
Power
Connector System
Cable-to-Board
Contact Current Rating
500mA
Contact Material
Copper Alloy
Contact Plating
Gold
ELV
Compliant
Flammability Rating
UL94 V-0
Housing Color
Black
Lead Free
Lead Free
Max Operating Temperature
185°C
Memory Type
SDRAM, DDR3 SDRAM,
Min Operating Temperature
-67°C
Mount
Surface Mount
Number of Contacts
204
Number of Positions
204
Number of Rows
2
Orientation
Straight
Package Quantity
150
Packaging
Tape and Reel
PCB Mount Retention
With
Pitch
0.024inch
Radiation Hardening
No
RoHS Compliant
Yes
Row Spacing
0.322inch
Sealable
No (Without)
Stack Height
0.362inch
Termination
Solder
Compliance
RoHS
Compliant
Datasheet
TE Connectivity 2-2013311-1 Datasheet
Download the complete datasheet for TE Connectivity 2-2013311-1 to view detailed technical specifications.
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