204-position, 2-row right-angle header for board-to-board applications, supporting DDR3 SDRAM and other memory types. Features a 0.024-inch pitch and 0.322-inch row spacing with a 5.2mm stack height. Rated for 500mA contact current and 1.5V voltage, with gold-plated copper alloy contacts and a thermoplastic insulator. Designed for surface mounting with solder termination and a UL94 V-0 flammability rating. Operates across a wide temperature range of -67°C to 185°C.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the TE Connectivity 2013289-2 datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
| Circuit Application | Power |
| Color | Black |
| Connector System | Cable-to-Board |
| Contact Current Rating | 500mA |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| Depth | 26.5mm |
| ELV | Compliant |
| Flammability Rating | UL94 V-0 |
| Housing Color | Black |
| Insulation Material | Thermoplastic |
| Lead Free | Lead Free |
| Length | 71mm |
| Max Operating Temperature | 185°C |
| Memory Type | SDRAM, DDR3 SDRAM, |
| Min Operating Temperature | -67°C |
| Mount | Surface Mount |
| Number of Contacts | 204 |
| Number of Positions | 204 |
| Number of Rows | 2 |
| Orientation | Right Angle |
| Package Quantity | 20 |
| Packaging | Tray |
| PCB Mount Retention | With |
| Pitch | 0.024inch |
| Plating | Gold |
| Plating Thickness | 254nm |
| Radiation Hardening | No |
| Reach SVHC Compliant | Unknown |
| RoHS Compliant | Yes |
| Row Spacing | 0.322inch |
| Sealable | No (Without) |
| Stack Height | 5.2mm |
| Termination | Solder |
| Voltage Rating | 1.5V |
| RoHS | Compliant |
Download the complete datasheet for TE Connectivity 2013289-2 to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
