204-position, 2-row right-angle header for board-to-board applications, supporting DDR3 SDRAM and other memory types. Features a 0.024-inch pitch and 0.322-inch row spacing with a 5.2mm stack height. Rated for 500mA contact current and 1.5V voltage, with gold-plated copper alloy contacts and a thermoplastic insulator. Designed for surface mounting with solder termination and a UL94 V-0 flammability rating. Operates across a wide temperature range of -67°C to 185°C.
Voltage Rating1.5V
MountingSurface Mount
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Technical Specifications
TE Connectivity 2013289-2 technical specifications.
General
Circuit Application
Power
Color
Black
Connector System
Cable-to-Board
Contact Current Rating
500mA
Contact Material
Copper Alloy
Contact Plating
Gold
Depth
26.5mm
ELV
Compliant
Flammability Rating
UL94 V-0
Housing Color
Black
Insulation Material
Thermoplastic
Lead Free
Lead Free
Length
71mm
Max Operating Temperature
185°C
Memory Type
SDRAM, DDR3 SDRAM,
Min Operating Temperature
-67°C
Mount
Surface Mount
Number of Contacts
204
Number of Positions
204
Number of Rows
2
Orientation
Right Angle
Package Quantity
20
Packaging
Tray
PCB Mount Retention
With
Pitch
0.024inch
Plating
Gold
Plating Thickness
254nm
Radiation Hardening
No
Reach SVHC Compliant
Unknown
RoHS Compliant
Yes
Row Spacing
0.322inch
Sealable
No (Without)
Stack Height
5.2mm
Termination
Solder
Voltage Rating
1.5V
Compliance
RoHS
Compliant
Datasheet
TE Connectivity 2013289-2 Datasheet
Download the complete datasheet for TE Connectivity 2013289-2 to view detailed technical specifications.
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