240-position, 2-row vertical header for board-to-board applications, supporting DDR3 SDRAM and SDRAM memory. Features a 0.039-inch pitch and 0.075-inch row spacing with through-hole termination. Contact current rating is 750mA, utilizing gold-plated copper alloy contacts. Operates within a temperature range of -55°C to 155°C, with a UL94 V-0 flammability rating and RoHS compliance.
MountingThrough Hole
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Technical Specifications
TE Connectivity 4-1932000-7 technical specifications.
General
| Circuit Application | Signal |
| Connector System | Board-to-Board |
| Contact Current Rating | 750mA |
| Contact Material | Copper Alloy |
| Contact Plating | Gold |
| ELV | Compliant |
| Flammability Rating | UL94 V-0 |
| Housing Color | Black |
| Max Operating Temperature | 155°C |
| Memory Type | SDRAM, DDR3 SDRAM, |
| Min Operating Temperature | -55°C |
| Mount | Through Hole |
| Number of Contacts | 240 |
| Number of Positions | 240 |
| Number of Rows | 2 |
| Orientation | Straight |
| Package Quantity | 4000 |
| Packaging | Tray |
| Pitch | 0.039inch |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Row Spacing | 0.075inch |
| Sealable | No (Without) |
| Termination | Through Hole |
Compliance
| RoHS | Compliant |
Datasheet
TE Connectivity 4-1932000-7 Datasheet
Download the complete datasheet for TE Connectivity 4-1932000-7 to view detailed technical specifications.
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