High-density interconnect (HDI) receptacle assembly featuring 100 positions across 4 rows, designed for signal applications. This through-hole mount component offers a 2.54mm pitch and 0.1inch row spacing, with a contact current rating of 3A. Constructed with a copper alloy contact material, it boasts gold and tin plating for enhanced conductivity and durability, operating within a temperature range of -65°C to 125°C. The right-angle PCB mounting orientation and 0.46inch height make it suitable for compact board-to-board interconnects.
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| Boss | No (Without) |
| Circuit Application | Signal |
| Color | Brown |
| Contact Current Rating | 3A |
| Contact Material | Copper Alloy |
| Contact Plating | Gold, Tin |
| Contact Post Length | 0.12inch |
| Contact Style | Socket |
| ELV | Compliant |
| Flammability Rating | UL94 V-0 |
| Gender | Receptacle |
| Height | 0.46inch |
| Housing Color | Natural |
| Lead Free | Lead Free |
| Lead Length | 3.048mm |
| Make First / Break Last | No |
| Mating Alignment | No (Without) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -65°C |
| Mount | Through Hole |
| Number of Contacts | 100 |
| Number of Positions | 100 |
| Number of Rows | 4 |
| Package Quantity | 7 |
| Packaging | Rail/Tube |
| PCB Mount Alignment | No (Without) |
| PCB Mount Retention | Without |
| PCB Mounting Orientation | Right Angle |
| PCB Thickness | 0.062inch |
| Pitch | 2.54mm |
| Plating | Gold |
| Plating Thickness | 760nm |
| RoHS Compliant | No |
| Row Spacing | 0.1inch |
| Sealable | No (Without) |
| Series | HDI (High Density Interconnect) |
| Stackable | No |
| Tail Length | 3.04mm |
| Termination | Through Hole |
| Underplate Material | Nickel |
| RoHS | Not Compliant |
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