PackageTSSOP
MountingSurface Mount
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Technical Specifications
Texas Instruments SN74CBT16209DGGR technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 12.6(Max) |
| Package Width (mm) | 6.2(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153ED |
| Logic Family | CBT |
| Configuration | 9 x 2:2 |
| Number of Elements per Chip | 1 |
| Number of Inputs per Chip | 18 |
| Number of Outputs per Chip | 18 |
| Process Technology | CMOS |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 01295 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Texas Instruments SN74CBT16209DGGR Datasheet
Download the complete datasheet for Texas Instruments SN74CBT16209DGGR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.