32-bit Digital Signal Processor (DSP) with fixed-point and floating-point capabilities, operating at a maximum speed of 300 MHz and delivering 2400 MIPS. Features a VLIW instruction set architecture and a C674x device core. This ROMLess DSP is housed in a 176-pin HLQFP EP package with gull-wing leads, designed for surface mounting. Includes interfaces for Ethernet, I2C, SPI, UART, and USB, with 2x I2C, 3x UART, 1x Ethernet, and 1x USB ports.
PackageHLQFP EP
MountingSurface Mount
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Technical Specifications
Texas Instruments TMS320C6745APTP3 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | HLQFP EP |
| Package Description | Heat Sinked Low Profile Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 176 |
| PCB | 176 |
| Package Length (mm) | 24.2(Max) |
| Package Width (mm) | 24.2(Max) |
| Package Height (mm) | 1.45(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BGA |
| Family Name | C6000 |
| Data Bus Width | 32bit |
| Instruction Set Architecture | VLIW |
| Numeric and Arithmetic Format | Fixed-Point|Floating-Point |
| Device Core | C674x |
| Program Memory Type | ROMLess |
| Maximum Speed | 300MHz |
| Number of Programmable I/Os | 16 |
| Device Million Instructions per Second | 2400MIPS |
| Device Input Clock Speed | 300MHz |
| Typical Operating Supply Voltage | 1.2V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Interface Type | Ethernet/I2C/SPI/UART/USB |
| I2C | 2 |
| CAN | 0 |
| UART | 3 |
| Ethernet | 1 |
| USART | 0 |
| USB | 1 |
| SPI | 2 |
| I2S | 0 |
| Programmability | No |
Compliance
| Cage Code | 01295 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.2 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Texas Instruments TMS320C6745APTP3 Datasheet
Download the complete datasheet for Texas Instruments TMS320C6745APTP3 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.