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Technical Specifications
Texas Instruments TPD12S015YFFRB technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
DSBGA
Package Description
Die Size Ball Grid Array
Lead Shape
Ball
Pin Count
28
PCB
28
Package Length (mm)
2.76
Package Width (mm)
1.56
Package Height (mm)
0.4
Seated Plane Height (mm)
0.63(Max)
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
01295
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Texas Instruments TPD12S015YFFRB Datasheet
Download the complete datasheet for Texas Instruments TPD12S015YFFRB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.