Toko Denshi
LLQ1608-F22NG
Ind High Frequency Chip Wirewound 22nH 2% 250MHz 38Q-Factor Ceramic 700mA 0603 T/R
Package0603
Inductance22nH
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Technical Specifications
Toko Denshi LLQ1608-F22NG technical specifications.
General
| Package/Case | 0603 |
| Core Material | Ceramic |
| Depth | 1.12mm |
| Height | 1.02mm |
| Inductance | 22nH |
| Max DC Current | 700mA |
| Packaging | Tape and Reel |
| Radiation Hardening | No |
| RoHS Compliant | Yes |
| Tolerance | 2% |
Compliance
| RoHS | Compliant |
Datasheet
Toko Denshi LLQ1608-F22NG Datasheet
Download the complete datasheet for Toko Denshi LLQ1608-F22NG to view detailed technical specifications.
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