PackageDIP Module
MountingThrough Hole
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Technical Specifications
Toshiba TLG337T(SMK) technical specifications.
General
Package/Case
DIP Module
Package Description
Dual In Line Module
Pin Count
10
PCB
10
Package Length (mm)
11
Package Width (mm)
7
Package Height (mm)
5
Mounting
Through Hole
Type
Module
Color
Green
Number of Digits
1
Configuration
Common Anode
Digit Size
0.3in
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Maximum Forward Current
20mA
Maximum Forward Voltage
2.5V
Maximum Reverse Current
5uA
Viewing Area Height
8mm
Viewing Area Length
4mm
Compliance
Cage Code
S0562
HTS Code
8531200040
Schedule B
8531200040
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TLG337T(SMK) Datasheet
Download the complete datasheet for Toshiba TLG337T(SMK) to view detailed technical specifications.
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