PackageDIP Module
MountingThrough Hole
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Technical Specifications
Toshiba TLG363S(KDEN) technical specifications.
General
Package/Case
DIP Module
Package Description
Dual In Line Module
Pin Count
10
PCB
10
Package Length (mm)
17.02
Package Width (mm)
12.47
Package Height (mm)
8
Mounting
Through Hole
Type
Module
Color
Green
Number of Digits
1
Configuration
Common Anode
Digit Size
0.53in
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Character Displayed
Numeric
Maximum Forward Current
20mA
Maximum Forward Voltage
2.5V
Maximum Reverse Current
5uA
Viewing Area Height
14.22mm
Viewing Area Length
7.8mm
Compliance
Cage Code
S0562
HTS Code
8531200040
Schedule B
8531200040
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TLG363S(KDEN) Datasheet
Download the complete datasheet for Toshiba TLG363S(KDEN) to view detailed technical specifications.
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