
High-speed, 2-channel logic output optocoupler featuring an open-collector output and DC input. This surface-mount device, housed in an 8-pin PDIP SMD package with gull-wing leads, offers a minimum isolation voltage of 2500 Vrms. Designed as an inverter, it supports a maximum data rate of 10MBd and a maximum forward current of 20 mA, operating within a temperature range of 0 °C to 70 °C.
Toshiba TLP2630(LF1) technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | DIP |
| Package/Case | PDIP SMD |
| Package Description | Surface Mount Plastic Dual In Line Package |
| Lead Shape | Gull-wing |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 9.66 |
| Package Width (mm) | 6.4 |
| Package Height (mm) | 3.65 |
| Seated Plane Height (mm) | 4 |
| Pin Pitch (mm) | 2.54 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Input Type | DC |
| Output Type | Open Collector |
| Number of Channels per Chip | 2 |
| Polarity | Inverting |
| Direction Type | Uni-Directional |
| Minimum Isolation Voltage | 2500Vrms |
| Logic Gate Type | Inverter |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Maximum Data Rate | 10MBd(Typ) |
| Maximum Forward Current | 20mA |
| Cage Code | S0562 |
| HTS Code | 8541408000 |
| Schedule B | 8541408000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
Download the complete datasheet for Toshiba TLP2630(LF1) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.