Optocoupler featuring a single-channel DC input and transistor with base DC output. This surface mount component is housed in an 8-pin PDIP SMD package with gull-wing leads, measuring 9.66mm in length, 6.4mm in width, and 3.65mm in height. It offers a minimum isolation voltage of 5000 Vrms and operates across a temperature range of -55°C to 100°C. Key electrical specifications include a minimum current transfer ratio of 20%, a maximum forward voltage of 1.85V, and a maximum collector current of 8mA.
PackagePDIP SMD
MountingSurface Mount
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Technical Specifications
Toshiba TLP759(D4-IGM-LF1) technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | DIP |
| Package/Case | PDIP SMD |
| Package Description | Surface Mount Plastic Dual In Line Package |
| Lead Shape | Gull-wing |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 9.66 |
| Package Width (mm) | 6.4 |
| Package Height (mm) | 3.65 |
| Seated Plane Height (mm) | 4 |
| Pin Pitch (mm) | 2.54 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-001BA |
| Output Type | DC |
| Input Type | DC |
| Output Device | Transistor With Base |
| Number of Channels per Chip | 1 |
| Minimum Isolation Voltage | 5000Vrms |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 100°C |
| Minimum Current Transfer Ratio | 20% |
| Maximum Forward Voltage | 1.85V |
| Maximum Current Transfer Ratio | 40(Typ)% |
| Maximum Collector Current | 8mA |
| Maximum Power Dissipation | 100mW |
| Maximum Reverse Voltage | 5V |
Compliance
| Cage Code | S0562 |
| EU RoHS | Yes |
| HTS Code | 8541408000 |
| Schedule B | 8541408000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Toshiba TLP759(D4-IGM-LF1) Datasheet
Download the complete datasheet for Toshiba TLP759(D4-IGM-LF1) to view detailed technical specifications.
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