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Toshiba TLP759(D4-IGM-TP1) technical specifications.
| Package Family Name | DIP |
| Package/Case | PDIP SMD |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 9.66 |
| Package Width (mm) | 6.4 |
| Package Height (mm) | 3.65 |
| Mounting | Surface Mount |
| Output Type | DC |
| Input Type | DC |
| Output Device | Transistor With Base |
| Number of Channels per Chip | 1 |
| Minimum Isolation Voltage | 5000Vrms |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 100°C |
| Minimum Current Transfer Ratio | 20% |
| Maximum Forward Voltage | 1.85V |
| Maximum Current Transfer Ratio | 40(Typ)% |
| Maximum Collector Current | 8mA |
| Maximum Power Dissipation | 100mW |
| Maximum Reverse Voltage | 5V |
| Cage Code | S0562 |
| HTS Code | 8541408000 |
| Schedule B | 8541408000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
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