PackagePDIP SMD
MountingSurface Mount
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Technical Specifications
Toshiba TLP759(D4-IGM-TP1) technical specifications.
General
Package Family Name
DIP
Package/Case
PDIP SMD
Pin Count
8
PCB
8
Package Length (mm)
9.66
Package Width (mm)
6.4
Package Height (mm)
3.65
Mounting
Surface Mount
Output Type
DC
Input Type
DC
Output Device
Transistor With Base
Number of Channels per Chip
1
Minimum Isolation Voltage
5000Vrms
Min Operating Temperature
-55°C
Max Operating Temperature
100°C
Minimum Current Transfer Ratio
20%
Maximum Forward Voltage
1.85V
Maximum Current Transfer Ratio
40(Typ)%
Maximum Collector Current
8mA
Maximum Power Dissipation
100mW
Maximum Reverse Voltage
5V
Compliance
Cage Code
S0562
HTS Code
8541408000
Schedule B
8541408000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Toshiba TLP759(D4-IGM-TP1) Datasheet
Download the complete datasheet for Toshiba TLP759(D4-IGM-TP1) to view detailed technical specifications.
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