PackagePDIP
MountingThrough Hole
Quick Jump:
Technical Specifications
Toshiba TLP759(LF2,J,F) technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
8
PCB
8
Package Length (mm)
9.66
Package Width (mm)
6.4
Package Height (mm)
3.65
Seated Plane Height (mm)
4.45
Pin Pitch (mm)
2.54
Package Weight (g)
0.54
Package Material
Plastic
Mounting
Through Hole
Output Type
DC
Input Type
DC
Output Device
Transistor With Base
Number of Channels per Chip
1
Minimum Isolation Voltage
5000Vrms
Compliance
Cage Code
S0562
EU RoHS
Yes
HTS Code
8541408000
Schedule B
8541408000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Toshiba TLP759(LF2,J,F) Datasheet
Download the complete datasheet for Toshiba TLP759(LF2,J,F) to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.