120 Series Silicone Thermal Joint Compound is a filled silicone dielectric compound used to facilitate heat transfer across metal-to-metal joints by filling microscopic air gaps. It is non-corrosive, non-conductive, and remains stable at high temperatures without drying out or melting. The compound is designed for use in power electronics, mounting semiconductors to heat sinks, and other applications requiring efficient thermal coupling.
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| Thermal Conductivity | 0.735W/m-K |
| Thermal Resistance | 0.05°C/W |
| Operating Temperature Range | -40 to 200°C |
| Dielectric Strength | 500V/mil |
| Specific Gravity | 2.1 |
| Color | Opaque White |
| Bleed | 0.5 max (24 hrs @ 200°C)% |
| Evaporation | 0.5 max (24 hrs @ 200°C)% |
| Container Size | 1lb |
| RoHS | Compliant |
| REACH | Compliant |
