Omnidirectional pin fin heat sink, passive type, designed for BGA packages including Super BGA, PBGA, and FPBGA. Features a 25mm square footprint with a 6.4mm height. Constructed from anodized aluminum for enhanced thermal performance, offering a natural thermal resistance of 12°C/W and 12°C/W at 100 LFM forced air flow. Mounts via adhesive and is lead-free.
PackageBGA
MountingAdhesive
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Technical Specifications
Wakefield 625-25ABT4E technical specifications.
General
| Package/Case | BGA |
| Color | Black |
| Finish | Anodized |
| Height | 6.4mm |
| Lead Free | Lead Free |
| Length | 25mm |
| Material | Aluminium, Anodized |
| Mount | Adhesive |
| Natural Thermal Resistance | 12°C/W |
| Package Cooled | BGA |
| Packaging | Tray |
| Series | 625 |
| Shape | Square, Fins |
| Thermal Resistance @ Forced Air Flow (100 LFM) | 12°C/W |
| Type | Passive |
| Width | 25mm |
Compliance
| RoHS | Compliant |
Datasheet
Wakefield 625-25ABT4E Datasheet
Download the complete datasheet for Wakefield 625-25ABT4E to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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