The 960-19-15-D-AB-0 is a high-performance push pin heatsink designed for BGA components. It features a square pin fin array made of black anodized aluminum for improved thermal dissipation. This specific model uses a diagonal push pin attachment method to secure the heatsink to the PCB.
Wakefield 960-19-15-D-AB-0 technical specifications.
| Length | 19.00mm |
| Width | 19.00mm |
| Fin Height | 15.00mm |
| Material | Aluminum |
| Finish | Black Anodized |
| Attachment Method | Diagonal Push Pin |
| Shape | Square, Pin Fins |
| Thermal Resistance @ Forced Air Flow | 6.40°C/W @ 200 LFM |
| RoHS | Compliant |
Download the complete datasheet for Wakefield 960-19-15-D-AB-0 to view detailed technical specifications.
No datasheet is available for this part.