The 960-19-15-D-AB-0 is a high-performance push pin heatsink designed for BGA components. It features a square pin fin array made of black anodized aluminum for improved thermal dissipation. This specific model uses a diagonal push pin attachment method to secure the heatsink to the PCB.
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Technical Specifications
Wakefield 960-19-15-D-AB-0 technical specifications.
General
| Length | 19.00mm |
| Width | 19.00mm |
| Fin Height | 15.00mm |
| Material | Aluminum |
| Finish | Black Anodized |
| Attachment Method | Diagonal Push Pin |
| Shape | Square, Pin Fins |
| Thermal Resistance @ Forced Air Flow | 6.40°C/W @ 200 LFM |
Compliance
| RoHS | Compliant |
Datasheet
Wakefield 960-19-15-D-AB-0 Datasheet
Download the complete datasheet for Wakefield 960-19-15-D-AB-0 to view detailed technical specifications.
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