Winchester Interconnect
M55302/58-D26F
26-Contact RCP Wire to Board Header, 2.54mm Pitch, 750VAC, -55 to 125°C
The M55302/58-D26F is a 26-contact RCP wire to board header from Winchester Interconnect, designed for use in high-reliability applications. This header features a 2.54mm terminal pitch and is rated for operation at temperatures between -55°C and 125°C. With a maximum voltage rating of 750VAC and a maximum current rating of 5A, this header is suitable for use in a variety of electrical systems. The header is available in a panel mount configuration, making it easy to integrate into existing designs. The M55302/58-D26F is a reliable and durable solution for connecting wires to printed circuit boards.
MountingPanel Mount
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Technical Specifications
Winchester Interconnect M55302/58-D26F technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 26 |
| Terminal Pitch | 2.54mm |
| Number of Rows | 2 |
| Termination Method | Wire Wrap |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Panel Mount |
| Max Current Rating | 5A |
| Max Voltage Rating | 750VAC |
| Height | 6.35mm |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
Winchester Interconnect M55302/58-D26F Datasheet
Download the complete datasheet for Winchester Interconnect M55302/58-D26F to view detailed technical specifications.
No datasheet is available for this part.