Winchester Interconnect
M55302/64-B24F
24-Contact RCP Wire-to-Board Header, 2-Row, 1.27mm Pitch, 5A, 750VAC, Through Hole
The M55302/64-B24F is a 24-contact RCP wire-to-board header from Winchester Interconnect. It features a 2-row design with a terminal pitch of 1.27mm and is rated for a maximum current of 5A and a maximum voltage of 750VAC. The header has a straight body orientation and is designed for through-hole mounting. It operates within a temperature range of -55°C to 125°C.
MountingThrough Hole
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Technical Specifications
Winchester Interconnect M55302/64-B24F technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 24 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Solder |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Max Voltage Rating | 750VAC |
| Height | 8.51mm |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
Winchester Interconnect M55302/64-B24F Datasheet
Download the complete datasheet for Winchester Interconnect M55302/64-B24F to view detailed technical specifications.
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