Conn Wire to Board RCP 30 POS 1.27mm Solder ST Thru-Hole
MountingThrough Hole
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Technical Specifications
Winchester Interconnect M55302/64-B30F technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 30 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Solder |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Max Voltage Rating | 750VAC |
| Height | 8.51mm |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
Winchester Interconnect M55302/64-B30F Datasheet
Download the complete datasheet for Winchester Interconnect M55302/64-B30F to view detailed technical specifications.
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