The M55302/64-B60X is a 60-contact RCP wire to board header with a terminal pitch of 1.27mm. It features a straight body orientation and is designed for through-hole mounting. This header is rated for a maximum operating temperature of 125°C and a minimum operating temperature of -55°C. It has a maximum current rating of 5A and a maximum voltage rating of 750VAC.
Winchester Interconnect M55302/64-B60X technical specifications.
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 60 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Solder |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Max Voltage Rating | 750VAC |
| Height | 8.51mm |
| RoHS Version | 2002/95/EC |
Download the complete datasheet for Winchester Interconnect M55302/64-B60X to view detailed technical specifications.
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