Winchester Interconnect
M55302/64-C60F
60-Contact RCP Wire to Board Header, 2 Rows, 1.27mm Pitch, Through Hole Mount
The M55302/64-C60F is a wire to board header from Winchester Interconnect with 60 RCP contacts. It features a 1.27mm terminal pitch and is designed for through hole mounting. The header operates within a temperature range of -55 to 125 degrees Celsius and has a maximum current rating of 5A. It is rated for 750VAC and is suitable for use in high-voltage applications.
MountingThrough Hole
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Technical Specifications
Winchester Interconnect M55302/64-C60F technical specifications.
General
| Type | Wire to Board |
| Gender | RCP |
| Number of Contacts | 60 |
| Terminal Pitch | 1.27mm |
| Number of Rows | 2 |
| Termination Method | Solder |
| Min Operating Temperature | -55°C |
| Max Operating Temperature | 125°C |
| Body Orientation | Straight |
| Mounting | Through Hole |
| Max Current Rating | 5A |
| Max Voltage Rating | 750VAC |
| Height | 8.51mm |
Compliance
| RoHS Version | 2002/95/EC |
Datasheet
Winchester Interconnect M55302/64-C60F Datasheet
Download the complete datasheet for Winchester Interconnect M55302/64-C60F to view detailed technical specifications.
No datasheet is available for this part.