Surface mountable, 324-pin Chip Scale Ball Grid Array (CSBGA) FPGA with 24,051 logic cells and 30,064 registers. Features 936 Kbit RAM, 76 18x18 multipliers, and 38 dedicated DSP blocks. Operates on 1.2V with 45nm process technology, offering up to 226 user I/Os and 3.2 Gbps transceiver speed. Includes 52 block RAMs and 6 DLLs/PLLs, suitable for -40°C to 100°C operation.
PackageCSBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6SLX25-2CSG324I technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSBGA |
| Package Description | Chip Scale Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 324 |
| PCB | 324 |
| Package Length (mm) | 15 |
| Package Width (mm) | 15 |
| Package Height (mm) | 0.9 |
| Seated Plane Height (mm) | 1.5(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-275KKAB-1 |
| Family Name | Spartan®-6 LX |
| Maximum Number of User I/Os | 226 |
| Number of Registers | 30064 |
| RAM Bits | 936Kbit |
| Device Logic Cells | 24051 |
| Process Technology | 45nm |
| Number of Multipliers | 76 (18x18) |
| Programmability | Yes |
| Transceiver Speed | 3.2Gbps |
| Program Memory Type | SRAM |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Dedicated DSP | 38 |
| Speed Grade | 2 |
| Device Number of DLLs/PLLs | 6 |
| Total Number of Block RAM | 52 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6SLX25-2CSG324I Datasheet
Download the complete datasheet for Xilinx XC6SLX25-2CSG324I to view detailed technical specifications.
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