Field Programmable Gate Array (FPGA) featuring 3840 logic cells and 4800 registers. This device offers 216 Kbit of RAM, 12 block RAMs, and 8 dedicated DSP slices, supporting 16 (18x18) multipliers. Fabricated on 45nm technology, it operates at 1.2V and provides up to 232 user I/Os with a transceiver speed of 3.2 Gbps. The FPGA is housed in a 324-pin Chip Scale Ball Grid Array (CSBGA) package with a 0.8mm pin pitch, designed for surface mounting. Operating temperature range is -40°C to 100°C.
PackageCSBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Xilinx XC6SLX4-2CSG324I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSBGA
Package Description
Chip Scale Ball Grid Array
Lead Shape
Ball
Pin Count
324
PCB
324
Package Length (mm)
15
Package Width (mm)
15
Package Height (mm)
0.9
Seated Plane Height (mm)
1.5(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
Spartan®-6 LX
Maximum Number of User I/Os
232
Number of Registers
4800
RAM Bits
216Kbit
Device Logic Cells
3840
Process Technology
45nm
Number of Multipliers
16 (18x18)
Programmability
Yes
Transceiver Speed
3.2Gbps
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
8
Speed Grade
2
Device Number of DLLs/PLLs
6
Total Number of Block RAM
12
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6SLX4-2CSG324I Datasheet
Download the complete datasheet for Xilinx XC6SLX4-2CSG324I to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.