ABL HEATSINKS BGA-FC-010 Heat Sink, For Ball Grid Array, Flip-Chip, BGA, 13.5 C/W, 10 mm, 40 mm, 40 mm
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| Package/Case | BGA |
| Color | Black |
| Height | 10mm |
| Length | 40mm |
| Mount | Adhesive |
| Natural Thermal Resistance | 13.5°C/W |
| Reach SVHC Compliant | No |
| Width | 40mm |
| RoHS | Compliant |
