ABL Heatsinks
BGA-FC-010
ABL HEATSINKS BGA-FC-010 Heat Sink, For Ball Grid Array, Flip-Chip, BGA, 13.5 C/W, 10 mm, 40 mm, 40 mm
PackageBGA
MountingAdhesive
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Technical Specifications
ABL Heatsinks BGA-FC-010 technical specifications.
General
Package/Case
BGA
Color
Black
Height
10mm
Length
40mm
Mount
Adhesive
Natural Thermal Resistance
13.5°C/W
Reach SVHC Compliant
No
Width
40mm
Compliance
RoHS
Compliant
Datasheet
ABL Heatsinks BGA-FC-010 Datasheet
Download the complete datasheet for ABL Heatsinks BGA-FC-010 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.