The A8437ECGLT is a surface-mount, ball-grid-array packaged IC designed for mobile phone xenon photoflash capacitor charging applications. It features a wafer-level chip scale package with 12 pins, measuring 1.64mm in length and 1.22mm in width. The device operates within a temperature range of -40°C to 85°C and is suitable for use in plastic packages.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | WLCSP |
| Package Description | Wafer Level Chip Scale Package |
| Lead Shape | Ball |
| Pin Count | 12 |
| PCB | 12 |
| Package Length (mm) | 1.64 |
| Package Width (mm) | 1.22 |
| Seated Plane Height (mm) | 0.55(Max) |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Category | Mobile Phone Xenon Photoflash Capacitor Charger |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 31019 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
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