600 MHz RISC microprocessor featuring a 481-pin BGA package for surface mounting. This dual-core MPU offers 64KB instruction and 64KB data cache. The plastic ball grid array package ensures robust connectivity.
PackageBGA
MountingSurface Mount
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Technical Specifications
AMD ALXG900EEYJ2VH technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
481
PCB
481
Package Material
Plastic
Mounting
Surface Mount
Family Name
AMD Geode™ LX 900
Instruction Set Architecture
RISC
Device Core
LX900
Maximum Speed
600MHz
Number of CPU Cores
2
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Instruction Cache Size
64KB
Data Cache Size
64KB
Multiply Accumulate
No
Compliance
Cage Code
6Z9Z3
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A002.a.1
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
AMD ALXG900EEYJ2VH Datasheet
Download the complete datasheet for AMD ALXG900EEYJ2VH to view detailed technical specifications.
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