
A dual common source UHF LDMOS RF power transistor operates across a 470–860 MHz frequency range, delivering a nominal output power of 600 W at 1 dB compression and 120 W average output power for DVB-T 8k OFDM signals. It exhibits a typical power gain of 20 dB at 858 MHz and 50 V, with a typical drain efficiency of 31% under the same conditions. Engineered for high reliability, it features ≥ 40:1 VSWR withstand ruggedness across all phases and a low typical thermal resistance of 0.15 K/W (junction–case), alongside a 110 V drain–source voltage rating. Typical capacitance values include 220 pF input, 1.2 pF reverse transfer, and 74 pF output at 50 V, providing -31 dBc intermodulation shoulder attenuation for DVB-T at 858 MHz. Encapsulated in a SOT539A (ACC-1230) flanged balanced ceramic package with 2 mounting holes and 4 leads, it supports bolt/screw-down mounting to a heatsink and is designed for a maximum junction temperature of 225 °C. RoHS and REACH compliant, handling guidelines for its Air Cavity Ceramic package should be observed.
Ampleon BLF888A-112 technical specifications.
| Device type | UHF LDMOS RF power transistor (dual, common source) |
| Frequency range | 470–860MHz |
| Nominal output power at 1 dB compression | 600W |
| Average output power (DVB-T 8k OFDM) | 120W |
| Power gain @ 50 V, 858 MHz | 20 (typ)dB |
| Drain efficiency @ 50 V, 858 MHz, IDq=1.3 A | 31 (typ)% |
| Ruggedness (VSWR withstand, all phases) | ≥ 40:1ratio |
| Thermal resistance junction–case | 0.15 (typ)K/W |
| Drain–source voltage rating | 110V |
| Gate–source voltage rating | 11V |
| Quiescent drain current for test conditions | 1.3A |
| Input capacitance (Ciss) @ VDS=50 V | 220 (typ)pF |
| Reverse transfer capacitance (Crss) @ VDS=50 V | 1.2 (typ)pF |
| Output capacitance (Coss) @ VDS=50 V | 74 (typ)pF |
| Package type | SOT539A (ACC-1230), flanged balanced ceramic, 2 mounting holes, 4 leads |
| Package dimensions (L × W × H) | 31.55 × 9.5 × 4.7mm |
| Pin count | 5 |
| Mounting | Bolt/screw-down to heatsink |
| Peak-to-average ratio (test condition) | 7.8dB |
| Intermodulation shoulder attenuation (DVB-T, 858 MHz) | -31dBc |
| Junction temperature (maximum) | 225°C |
| Soldering/handling | Air Cavity Ceramic package; follow AN10896 guidelines |
| RoHS | Compliant |
| REACH | Compliant |
| Eccn (us) | EAR99 |
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