The AS3661-BWLT is a 25-pin Ball Grid Array Power Management IC packaged in a Wafer Level Chip Scale Package (WLCSP) with a plastic material and surface mount configuration. It operates over a temperature range of -30°C to 85°C with a maximum supply voltage of 5.5V and a maximum supply current of 220mA. Typical operating supply voltage is 3.3V or 5V.
PackageWLCSP
MountingSurface Mount
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Technical Specifications
AMS AS3661-BWLT technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | WLCSP |
| Package Description | Wafer Level Chip Scale Package |
| Lead Shape | Ball |
| Pin Count | 25 |
| PCB | 25 |
| Package Length (mm) | 2.29 |
| Package Width (mm) | 2.29 |
| Package Height (mm) | 0.4 |
| Seated Plane Height (mm) | 0.6 |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Min Operating Temperature | -30°C |
| Max Operating Temperature | 85°C |
| Max Operating Supply Voltage | 5.5V |
| Maximum Supply Current | 220uA |
| Min Operating Supply Voltage | 2.7V |
| Typical Operating Supply Voltage | 3.3|5V |
Compliance
| Cage Code | 0852N |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Datasheet
AMS AS3661-BWLT Datasheet
Download the complete datasheet for AMS AS3661-BWLT to view detailed technical specifications.
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