PackageMSOP
MountingSurface Mount
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Technical Specifications
Analog Devices AD8209WBRMZ technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
MSOP
Package/Case
MSOP
Package Description
Micro Small Outline Package
Lead Shape
Gull-wing
Pin Count
8
PCB
8
Package Length (mm)
3
Package Width (mm)
3
Package Height (mm)
0.85
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-187AA
Type
Difference Amplifier
Number of Elements per Chip
2
Number of Channels per Chip
1
Minimum PSRR
66dB
Maximum Input Offset Voltage
2@5VmV
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices AD8209WBRMZ Datasheet
Download the complete datasheet for Analog Devices AD8209WBRMZ to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.