PackageLFCSP EP
MountingSurface Mount
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Technical Specifications
Analog Devices ADE7858ACPZ technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
CSP
Package/Case
LFCSP EP
Package Description
Lead Frame Chip Scale Package, Exposed Pad
Lead Shape
No Lead
Pin Count
40
PCB
40
Package Length (mm)
6
Package Width (mm)
6
Package Height (mm)
0.73
Seated Plane Height (mm)
0.75
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220VJJD-2
Category
Energy Measurement
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices ADE7858ACPZ Datasheet
Download the complete datasheet for Analog Devices ADE7858ACPZ to view detailed technical specifications.
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