PackageLFCSP EP
MountingSurface Mount
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Technical Specifications
Analog Devices ADE7868ACPZ-RL technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | CSP |
| Package/Case | LFCSP EP |
| Package Description | Lead Frame Chip Scale Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 40 |
| PCB | 40 |
| Package Length (mm) | 6 |
| Package Width (mm) | 6 |
| Package Height (mm) | 0.73 |
| Seated Plane Height (mm) | 0.75 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-220VJJD-2 |
| Category | Energy Measurement |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 24355 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Analog Devices ADE7868ACPZ-RL Datasheet
Download the complete datasheet for Analog Devices ADE7868ACPZ-RL to view detailed technical specifications.
No datasheet is available for this part.