PackageLFCSP EP
MountingSurface Mount
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Technical Specifications
Analog Devices ADL5561ACPZ-WP technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
CSP
Package/Case
LFCSP EP
Package Description
Lead Frame Chip Scale Package, Exposed Pad
Lead Shape
No Lead
Pin Count
16
PCB
16
Package Length (mm)
3
Package Width (mm)
3
Package Height (mm)
0.83
Seated Plane Height (mm)
0.85
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220VEED-4
Type
Differential Amplifier
Number of Elements per Chip
4
Number of Channels per Chip
1
Output Type
Differential
Maximum Input Bias Current
3(Typ)@3.3VuA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices ADL5561ACPZ-WP Datasheet
Download the complete datasheet for Analog Devices ADL5561ACPZ-WP to view detailed technical specifications.
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