PackageWLCSP
MountingSurface Mount
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Technical Specifications
Analog Devices ADP1649ACBZ-R7 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
WLCSP
Package Description
Wafer Level Chip Scale Package
Lead Shape
Ball
Pin Count
12
PCB
12
Package Length (mm)
2
Package Width (mm)
1.5
Package Height (mm)
0.36
Seated Plane Height (mm)
0.6
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
5V
Maximum Supply Current
5300(Typ)uA
Min Operating Supply Voltage
2.7V
Typical Operating Supply Voltage
3.3V
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices ADP1649ACBZ-R7 Datasheet
Download the complete datasheet for Analog Devices ADP1649ACBZ-R7 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.