High-performance Digital Signal Processor (DSP) featuring 16-bit/32-bit fixed-point processing and a maximum speed of 400 MHz. This 168-pin CSP-BGA (Chip Scale Ball Grid Array) component, measuring 12x12x1.26mm with a 0.8mm pin pitch, supports surface mount installation. It offers 116KB RAM, a Modified Harvard architecture, and interfaces including 2x SPI and 2x UART. Operating across a temperature range of -40°C to 85°C, it utilizes a 1.8V, 2.5V, or 3.3V supply voltage.
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Analog Devices ADSP-BF512BBCZ-4F4 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | CSP-BGA |
| Package Description | Chip Scale Ball Grid Array Package |
| Lead Shape | Ball |
| Pin Count | 168 |
| PCB | 168 |
| Package Length (mm) | 12 |
| Package Width (mm) | 12 |
| Package Height (mm) | 1.26 |
| Seated Plane Height (mm) | 1.6 |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-275GGAB-1 |
| Family Name | ADSP-BF51x |
| Data Bus Width | 16|32bit |
| Instruction Set Architecture | Modified Harvard |
| Numeric and Arithmetic Format | Fixed-Point |
| Program Memory Type | ROMLess |
| RAM Size | 116KB |
| Maximum Speed | 400MHz |
| Number of Programmable I/Os | 40 |
| Device Input Clock Speed | 400MHz |
| Typical Operating Supply Voltage | 1.8|2.5|3.3V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Interface Type | SPI/UART |
| I2C | 0 |
| CAN | 0 |
| UART | 2 |
| Ethernet | 0 |
| USART | 0 |
| USB | 0 |
| SPI | 2 |
| I2S | 0 |
| Programmability | No |
| Cage Code | 24355 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.2 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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