High-performance Digital Signal Processor (DSP) featuring 16-bit/32-bit fixed-point processing and a maximum speed of 400 MHz. This 168-pin CSP-BGA (Chip Scale Ball Grid Array) component, measuring 12x12x1.26mm with a 0.8mm pin pitch, supports surface mount installation. It offers 116KB RAM, a Modified Harvard architecture, and interfaces including 2x SPI and 2x UART. Operating across a temperature range of -40°C to 85°C, it utilizes a 1.8V, 2.5V, or 3.3V supply voltage.
PackageCSP-BGA
MountingSurface Mount
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Technical Specifications
Analog Devices ADSP-BF512BBCZ-4F4 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSP-BGA
Package Description
Chip Scale Ball Grid Array Package
Lead Shape
Ball
Pin Count
168
PCB
168
Package Length (mm)
12
Package Width (mm)
12
Package Height (mm)
1.26
Seated Plane Height (mm)
1.6
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-275GGAB-1
Family Name
ADSP-BF51x
Data Bus Width
16|32bit
Instruction Set Architecture
Modified Harvard
Numeric and Arithmetic Format
Fixed-Point
Program Memory Type
ROMLess
RAM Size
116KB
Maximum Speed
400MHz
Number of Programmable I/Os
40
Device Input Clock Speed
400MHz
Typical Operating Supply Voltage
1.8|2.5|3.3V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Interface Type
SPI/UART
I2C
0
CAN
0
UART
2
Ethernet
0
USART
0
USB
0
SPI
2
I2S
0
Programmability
No
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices ADSP-BF512BBCZ-4F4 Datasheet
Download the complete datasheet for Analog Devices ADSP-BF512BBCZ-4F4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.