168-pin CSP-BGA digital signal processor (DSP) operating at 300 MHz. Features 16/32-bit data bus width, fixed-point numeric format, and Modified Harvard architecture. Includes 48KB RAM, 40 programmable I/Os, and supports I2C, SPI, UART, and Ethernet interfaces. Surface mountable with a 12mm x 12mm x 1.26mm plastic package, operating from -40°C to 85°C.
PackageCSP-BGA
MountingSurface Mount
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Technical Specifications
Analog Devices ADSP-BF516BBCZ-3 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
CSP-BGA
Package Description
Chip Scale Ball Grid Array Package
Lead Shape
Ball
Pin Count
168
PCB
168
Package Length (mm)
12
Package Width (mm)
12
Package Height (mm)
1.26
Seated Plane Height (mm)
1.6
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-275GGAB-1
Family Name
ADSP-BF51x
Data Bus Width
16|32bit
Instruction Set Architecture
Modified Harvard
Numeric and Arithmetic Format
Fixed-Point
Program Memory Type
ROMLess
RAM Size
48KB
Maximum Speed
300MHz
Number of Programmable I/Os
40
Device Input Clock Speed
300MHz
Typical Operating Supply Voltage
1.8|2.5|3.3|7V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Interface Type
I2C/SPI/UART
I2C
2
CAN
0
UART
2
Ethernet
1
USART
0
USB
0
SPI
2
I2S
0
Programmability
No
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices ADSP-BF516BBCZ-3 Datasheet
Download the complete datasheet for Analog Devices ADSP-BF516BBCZ-3 to view detailed technical specifications.
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