Single 2:1 analog multiplexer, featuring an 8-pin LFCSP EP package with exposed pad. This surface-mount component offers a 2:1 multiplexer architecture with 2 inputs and 1 output per chip. The compact LFCSP EP package measures 3mm x 3mm x 0.73mm with a 0.5mm pin pitch, conforming to JEDEC MO-229WEED. Operating temperature range is -40°C to 85°C.
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Analog Devices ADV3219ACPZ-R7 technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | CSP |
| Package/Case | LFCSP EP |
| Package Description | Lead Frame Chip Scale Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 8 |
| PCB | 8 |
| Package Length (mm) | 3 |
| Package Width (mm) | 3 |
| Package Height (mm) | 0.73 |
| Seated Plane Height (mm) | 0.75 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Package Orientation | Yes |
| Package Orientation Marking Type | Dot |
| Jedec | MO-229WEED |
| Type | Analog Multiplexer |
| Configuration | Single 2:1 |
| Number of Channels per Chip | 1 |
| Multiplexer Architecture | 2:1 |
| Number of Inputs per Chip | 2 |
| Number of Outputs per Chip | 1 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 24355 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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