100-Pin LFCSP EP Tray analog switch IC featuring a 16x16 array configuration. This surface mount component offers a 700 MHz typical 3dB bandwidth, supporting dual supply voltages from ±4.5 V to ±5.5 V. The Lead Frame Chip Scale Package measures 12mm x 12mm x 0.84mm with a 0.4mm pin pitch, operating across a -40 °C to 85 °C temperature range.
PackageLFCSP EP
MountingSurface Mount
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Technical Specifications
Analog Devices ADV3226ACPZ technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
CSP
Package/Case
LFCSP EP
Package Description
Lead Frame Chip Scale Package, Exposed Pad
Lead Shape
No Lead
Pin Count
100
PCB
100
Package Length (mm)
12
Package Width (mm)
12
Package Height (mm)
0.84
Seated Plane Height (mm)
0.85
Pin Pitch (mm)
0.4
Package Material
Plastic
Mounting
Surface Mount
Array Configuration
16x16
Number of Arrays
1
Category
General Purpose
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
3dB Bandwidth Range
>=250MHz
3dB Bandwidth
700(Typ)MHz
Minimum Dual Supply Voltage
±4.5V
Typical Dual Supply Voltage
±5V
Maximum Dual Supply Voltage
±5.5V
Power Supply Type
Dual
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices ADV3226ACPZ Datasheet
Download the complete datasheet for Analog Devices ADV3226ACPZ to view detailed technical specifications.
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