PackageQFN EP
MountingSurface Mount
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Technical Specifications
Analog Devices HMC822LP6CE technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
QFN EP
Package Description
Quad Flat No Lead Package, Exposed Pad
Lead Shape
No Lead
Pin Count
40
PCB
40
Package Length (mm)
6.1(Max)
Package Width (mm)
6.1(Max)
Package Height (mm)
0.85(Max)
Seated Plane Height (mm)
0.9(Max)
Pin Pitch (mm)
0.56(Max)
Package Material
Plastic
Mounting
Surface Mount
Number of Outputs per Chip
1
Input Logic Level
CMOS
Output Logic Level
CMOS
Clock Input Frequency
0.1 to 200MHz
Min Operating Supply Voltage
3V
Max Operating Supply Voltage
3.5V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices HMC822LP6CE Datasheet
Download the complete datasheet for Analog Devices HMC822LP6CE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.