PackageCQFN EP
MountingSurface Mount
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Technical Specifications
Analog Devices HMC874LC3C technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | CQFN EP |
| Package Description | Ceramic Quad Flat No Lead Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 3 |
| Package Width (mm) | 3 |
| Package Height (mm) | 1.31(Max) |
| Package Material | Ceramic |
| Mounting | Surface Mount |
| Manufacturer Type | Clocked Comparator |
| Number of Channels per Chip | 1 |
| Rail to Rail | No |
| Typical PSRR | 38dB |
| Maximum Input Offset Voltage | 5(Typ)@3.3V/-3VmV |
| Maximum Input Bias Current | 15(Typ)@3.3V/-3VuA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
Compliance
| Cage Code | 24355 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Analog Devices HMC874LC3C Datasheet
Download the complete datasheet for Analog Devices HMC874LC3C to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.