Surface-mount LQFN package outline defines a 30-lead package body measuring 4 mm by 5 mm by 0.95 mm nominal. The package uses a 0.50 mm lead pitch with 0.25 mm nominal terminal width. The outline includes a segmented exposed heat feature arranged in a matrix format and a package height range from 0.85 mm to 1.05 mm. Dimensions are specified in millimeters with ASME Y14.5M-1994 dimensioning and tolerancing.
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| Package family | LQFN |
| Lead count | 30 |
| Body length D | 4.00mm |
| Body width E | 5.00mm |
| Nominal package height A | 0.95mm |
| Package height A range | 0.85 to 1.05mm |
| Terminal pitch e | 0.50mm |
| Terminal width b | 0.22 min, 0.25 nom, 0.28 maxmm |
| Terminal length L | 0.30 min, 0.40 nom, 0.50 maxmm |
| Exposed feature length D1 | 2.70mm |
| Exposed feature width E1 | 3.70mm |
| Substrate thickness H1 | 0.25 refmm |
| Mold cap height H2 | 0.70 refmm |
| Stand-off A1 maximum | 0.03mm |
| Pin 1 notch | 0.20 mm x 45 degrees |
| Suggested PCB layout length | 5.50mm |
| Suggested PCB layout width | 4.50mm |
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