PackageTSSOP EP
MountingSurface Mount
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Technical Specifications
Analog Devices LT3492IFE#PBF technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP EP
Package Description
Thin Shrink Small Outline Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
9.8(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
1.05(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AET
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Max Operating Supply Voltage
30V
Maximum Supply Current
8000uA
Min Operating Supply Voltage
3V
Typical Operating Supply Voltage
3.3|5|9|12|15|18|24V
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices LT3492IFE#PBF Datasheet
Download the complete datasheet for Analog Devices LT3492IFE#PBF to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.