
The LT3760IFE#PBF is a 28-pin TSSOP EP Lead-Frame SMT Power Management IC from Analog Devices. It features a Thin Shrink Small Outline Package, Exposed Pad and is designed for surface mount applications. The device operates over a temperature range of -40°C to 125°C and has a maximum operating supply voltage of 40V. It can handle a maximum supply current of 12mA and is suitable for use in LED drivers.
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Analog Devices LT3760IFE#PBF technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP EP |
| Package Description | Thin Shrink Small Outline Package, Exposed Pad |
| Lead Shape | Gull-wing |
| Pin Count | 28 |
| PCB | 28 |
| Package Length (mm) | 9.8(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153AET |
| Number of Segments | 45 |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
| Max Operating Supply Voltage | 40V |
| Maximum Supply Current | 12000uA |
| Min Operating Supply Voltage | 6V |
| Typical Operating Supply Voltage | 9|12|15|18|24V |
| Cage Code | 24355 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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