PackageSSOP N
MountingSurface Mount
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Technical Specifications
Analog Devices LTC3108EGN#PBF technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SSOP N
Package Description
Shrink Small Outline Package Narrow Body
Lead Shape
Gull-wing
Pin Count
16
PCB
16
Package Length (mm)
4.98(Max)
Package Width (mm)
3.99(Max)
Package Height (mm)
1.5(Max)
Seated Plane Height (mm)
1.75(Max)
Pin Pitch (mm)
0.64
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-137AB
Category
Step-Up Converter and Power Manager
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
Compliance
Cage Code
24355
EU RoHS
Yes
HTS Code
8542390001
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Analog Devices LTC3108EGN#PBF Datasheet
Download the complete datasheet for Analog Devices LTC3108EGN#PBF to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.